Prediction of process-induced deformation of CFRP laminates considering interfacial interaction
Vol. 20., No.8., Pages 774-787, 2026
DOI: 10.3144/expresspolymlett.2026.59
DOI: 10.3144/expresspolymlett.2026.59
GRAPHICAL ABSTRACT

ABSTRACT
During the manufacturing of carbon fiber–reinforced plastic laminates (CFRPLs), incompatible residual strain leads to the problem of slippage interaction at the interface between the mold and the resin. Interfacial slippage between the mold and the resin is a key factor governing the dimensional stability of the composite structure. We established a finite element (FE) model considering slippage to obtain the process-induced deformation (PID) of CFRPLs. We proposed a temperature-dependent constitutive model for slipping between the mold and the resin, which combines experimental results with a multi-segmented cohesion model. The accuracy of FE simulation was experimentally verified with rectangular laminates. We showed that the interaction between the mold and the resin presents typical bond-slip characteristics. The use of a release agent alters the surface condition of the mold, resulting in a significant reduction in the bonding strength between the mold and the resin. The proposed interface constitutive model improves the prediction accuracy of PID by 25.4 to 93.5%. The research outcomes offer theoretical and engineering support for enhancing the dimensional accuracy and manufacturing quality of aerospace composite structures.




